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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[61]张广玉, 许军, 马海涛, 程从前, 王富岗, 赵杰.在役十万小时一段炉转化管的寿命评估[J],大氮肥,2016,39(5):296-300
[62]Zhao, N., Zhong, Y., Huang, M. L., Dong, W., Ma, H. T., Wang, Y. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
[63]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under t...[A],2016,264-267
[64]Kunwar, Anil, Ma, Haoran, Qi, Meng, Sun, Junhao, Qu, Lin, Guo, Bingfeng, Zhao, Ning, Wang, Yunpeng, Haitao.Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu J...[A],2016,608-611
[65]Jiang, Chengrong, Guo, Bingfeng, Ma, Haoran, Kunwar, Anil, Meng, Zhixian, Haitao.The Study of the Growth Behavior of Cu6Sn5 at the Sn/Cu Interface during the Heating Preservati...[A],2016,327-330
[66]Kunwar, Anil, Givernaud, Julien, Ma, Haoran, Wang, Yunpeng, Haitao, Meng, Zhixian, Shang, Shengyan.Modelling the Melting of Sn0.7Cu Solder Using the Enthalpy Method[A],2016,166-169
[67]Zhao, Ning, Ma, Haitao, Huang, Mingliang, Zhong, Yi, Deng, Jianfeng.Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,273-276
[68]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Ma, Haitao.In situ study of real-time growth behavior of IMC morphology evolution during the Sn/Cu solderi...[A],2016,395-399
[69]Ma, Haoran, Kunwar, Anil, Meng, Zhixian, Guo, Bingfeng, Zhao, Ning, Haitao.The morphology variation of IMC on the solder/bubble interface under different cooling rates an...[A],2016,425-428
[70]Kunwar, Anil, Ma, Haoran, Haitao, Guo, Bingfeng, Meng, Zhixian, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromi...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(7):7699-7706

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