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Paper Publications

[71]Kunwar, Anil, Ma, Haoran, Haitao, Sun, Junhao, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2016,172:211-215
[72]Zhou, C. H., Liu, A. L., Ma, H. T., Wang, L., CH (reprint author), Heilongjiang Univ Sci & Technol, Sch Mat Sci & Engn, Harbin 150022, Peoples R China..The Oxide-Scale Growth and Failure on an Fe-16Cr Alloy in the Presence of Compressive Stress[J],OXIDATION OF METALS,2016,85(5-6):537-546
[73]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
[74]Zhong, Yi, Huang, Mingliang, Deng, Jianfeng, Ma, Haitao, Dong, Wei, Zhao, Ning.STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION[A],2016
[75]王云鹏, 宋学官, 赵宁, 马海涛.Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12):1052-1052
[76]马海涛, 赵宁, 黄明亮.On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solde...[J],Materials Letters,2016,172(1):211-215
[77]赵宁, 黄明亮, 马海涛.Interfacial reactions of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration[A],2016,1(1):273-276
[78]马海涛, 王云鹏, 赵宁, 黄明亮.Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder join...[J],Journal of Material Science: Materials in Electronics,2016,28(1):5398-5406
[79]Wan, B. Q., Sun, X. Y., Ma, H. T., Feng, R. F., Li, Y. S., Yang, Q., Q (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Plasma enhanced chemical vapor deposition of diamond coatings on Cu-W and Cu-WC composites[J],SURFACE & COATINGS TECHNOLOGY,2015,284:133-138
[80]Ma, Haitao, Kunwar, Anil, Sun, Junhao, Guo, Bingfeng, Haoran, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the increase of intermetallic compound thickness at anode of molten tin due to...[J],SCRIPTA MATERIALIA,2015,107:88-91

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