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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
联系方式：15641188312
电子邮箱：htma@dlut.edu.cn
扫描关注
- [81]Kunwar, Anil, Ma, Haitao, Sun, Junhao, Li, Shuang, Liu, Jiahui, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Modeling the Diffusion-Driven Growth of a Pre-Existing Gas Bubble in Molten Tin[J],METALS AND MATERIALS INTERNATIONAL,2015,21(5):962-970
- [82]Sun, X., Ma, H. T., Yang, L. Z., Sanchez-Pasten, M., Penner, D. Craig, Li, Y. S., Q., Q (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Metal dusting, carburization and diamond deposition on Fe-Cr alloys in CH4-H-2 plasma atmospher...[J],CORROSION SCIENCE,2015,98:619-625
- [83]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interco...[J],SCIENTIFIC REPORTS,2015,5:13491
- [84]谭毅, 游小刚, 王轶农, 石爽, 马海涛, 李鹏廷.镍基高温合金高纯化制备及评价[A],2015,331-331
- [85]赵宁, 钟毅, 黄明亮, 马海涛, Zhao, Ning.微焊点中金属原子的热迁移及其对界面反应影响的研究进展[J],中国有色金属学报,2015,25(8):2157-2166
- [86]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao.Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient[A],2015,1263-1266
- [87]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Zhao, Ning.Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint[A],2015,1271-1274
- [88]赵宁, 钟毅, 黄明亮, 马海涛, 刘小平, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..热迁移对Cu/Sn/Cu焊点液-固界面Cu_6Sn_5生长动力学的影响[J],物理学报,2015,64(16):348-357
- [89]马海涛.carburization and diamond deposition on Fe-Cr alloys in CH4-H-2 plasma atmospheres[J],CORROSION SCIENCE,2015,98(9):619-625
- [90]赵宁, 黄明亮, 马海涛.热迁移对Cu/Sn/Cu焊点液-固界面Cu6Sn5生长动力学的影响[J],物理学报,2015,64(16):166601-166601
- [91]Zhao, N., Huang, M. L., Zhong, Y., Ma, H. T., Pan, X. M., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions ...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(1):345-352
- [92]Qu, Lin, Zhao, Ning, Ma, Haitao, Huijing, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116085, Peoples R China..In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Solde...[J],JOURNAL OF ELECTRONIC MATERIALS,2015,44(1):467-474
- [93]Huang, M. L., Zhang, Z. J., Ma, H. T., Chen, L. D., ML (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration[J],JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2014,30(12):1235-1242
- [94]Li, Y. S., Hirose, A., Yang, Q., Feng, R. F., Zhang, C. Z., L. Z., Ma, H. T., YS (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Competitive graphitization and diamond growth on hot-dip aluminized carbon steel substrate[J],APPLIED SURFACE SCIENCE,2014,314:1041-1046
- [95]Zhao, N., Huang, M. L., Ma, H. T., Yang, F., Zhang, Z. J., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Influence of Rare Earth Ce Addition on the Microstructure, Properties and Soldering Reaction of...[J],METALS AND MATERIALS INTERNATIONAL,2014,20(5):953-958
- [96]Kunwar, Anil, Ma, Haitao, Sun, Junhao, Qu, Lin, Li, Shuang, Liu, Jiahui.A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder[A],2014,602-605
- [97]Li, Shuang, Du, Yao, Qu, Lin, Kunwar, Anil, Sun, Junhao, Liu, Jiahui, Zhao, Ning, Huang, Mingliang, Ma, Haitao.The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows[A],2014,937-939
- [98]Liu, Jiahui, Ma, Haitao, Li, Shuang, Sun, Junhao, Kunwar, Anil, Miao, Wang, Hao, Jianjie, Bao, Yanpeng.The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu la...[A],2014,949-952
- [99]Sun, Junhao, Du, Yao, Kunwar, Anil, Qu, Lin, Li, Shuang, Liu, Jiahui, Ma, H. T., Guo, Binfeng.In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu inte...[A],2014,976-979
- [100]Li, Y. S., Yang, Q., Hirose, A., L. Z., Ma, H. T., Feng, R. F., YS (reprint author), Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada..Enhanced diamond deposition on Kovar alloy substrate with Al interlayer[J],MATERIALS RESEARCH INNOVATIONS,2014,18:979-982