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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
办公地点：材料馆332
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- [41]Ma, H.R..Ma, H.T.,Zhao, N.,Wang, Y.P.,Chen, J..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows[A],2017:1402-1405
- [42]Zhong, Yi.Zhao, N; Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Huang, Mingliang,Yin, Luqiao,Wong, Chingping,Zhao, Ning,Dong, Wei,Ma, Haitao.Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
- [43]Yao, Mingjun.Zhao, N; Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Yu, DQ (reprint author), Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300, Peoples R China..Yu, Daquan,Ma, Haitao,Fan, Jun,Zhao, Ning,Xiao, Zhiyi.Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):9091-9095
- [44]Zhao, N..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Wong, C. P.,Yao, M. J.,Ma, H. T..In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluorescence XAFS[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(12):8824-8831
- [45]Zhao, N..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Huang, M. L.,Ma, H. T.,Deng, J. F.,Zhong, Y..Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration[J],JOURNAL OF ELECTRONIC MATERIALS,2017,46(4):1931-1936
- [46]Guo, Bingfeng.Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Kunwar, Anil,Zhao, Ning,Huang, Mingliang,Jiang, Chengrong,Wang, Yunpeng,Ma, Haitao.Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid-solid interface during soldering cooling stage[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406
- [47]Yao, Mingjun.Xiao, Zhiyi,Ma, Haitao,Yu, Daquan,Zhao, Ning,Fan, Jun.DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP[A],2017
- [48]Zhao, N..Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China.; Wong, CP (reprint author), Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA..Wong, C. P.,Dong, W.,Huang, M. L.,Ma, H. T.,Zhong, Y..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect[J],APPLIED PHYSICS LETTERS,2017,110(9)
- [49]Zhong, Y..Zhao, N; Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Huang, M. L.,Zhao, N.,Ma, H. T.,Dong, W..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
- [50]Kunwar, Anil.Ma, Haitao,Song, Xueguan,Wang, Yunpeng,Tonks, Michael R.,Shang, Shengyan.Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn under Thermal Gradient[A],2017:1502-1507