Personal Information
Associate Professor Supervisor of Master's Candidates
Paper Publications
- [1] 孔铭扬.黄正兴,Junsheng Liang.刘志春,王海刚,徐德志,王瀚彬,赵祉澎.Remarkable enhancement of thermal conductivity induced by coordination transition in SiO2 thin films[J],Journal of Materials Science,2024
- [2] He, Tiantian.Huang, ZX (reprint author), Dalian Univ Technol, Fac Elect Informat & Elect Engn, Key Lab Liaoning Integrated Circuits Technol, Dalian 116024, Peoples R China..Li, Ting,Huang, Zhengxing,Tang, Zhenan,Guan, Xiangyu.Mechanical and thermal properties of the coaxial carbon nanotube@boron nitride nanotube composite[J],PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES,2019,107:182-186
- [3] 贺天天.黄正兴,唐祯安,李婷.Mechanical and thermal properties of the coaxial carbon nanotube@boron[J],Physica E,2019,107:182-186
- [4] Qu, Shilian.Liu, W (reprint author), Tsinghua Univ, Sch Mat Sci & Engn, Lab Adv Mat, Beijing 100084, Peoples R China..Chen, Wanqi,Cui, Wei,Sun, Hao,Kreter, Arkadi,Yuan, Yue,Cheng, Long,Huang, Zhengxing,Xu, Ben,Tang, Zhenan,Jia, Yuzhen,Lian, YouYun,Liu, Xiang,Liu, Wei.Degradation of thermal conductivity of the damaged layer of tungsten irradiated by helium-plasma[J],FUSION ENGINEERING AND DESIGN,2018,137:97-103
- [5] 黄正兴.孙豪,李奇松,管相宇.InSb薄膜热导率温度特性及传热机理[J],大连理工大学学报,2018,58(5):519-525
- [6] Li, Ting.Huang, ZX (reprint author), Dalian Univ Technol, Fac Elect Informat & Elect Engn, Key Lab Liaoning Integrated Circuits Technol, Dalian 116024, Peoples R China..Yu, Jun,Tang, Zhenan,Huang, Zhengxing.Substrate effects on the thermal performance of in-plane graphene/hexagonal boron nitride heterostructures[J],CARBON,2018,130:396-400
- [7] 曲世联.陈婉琦,黄正兴.He注入对W在瞬态热负荷条件下熔化行为的影响[J],稀有金属,2018,28:283-
- [8] Li, Qisong.Zhang, Long,Sun, Hao,Zhang, Kui,Huang, Zhengxing,Wei, Jingsong.Temperature dependent thermal conductivity and transition mechanism in amorphous and crystalline Sb2Te3 thin films[J],SCIENTIFIC REPORTS,2017,7(1):13747
- [9] Li, Ting.Huang, ZX (reprint author), Dalian Univ Technol, Fac Elect Informat & Elect Engn, Key Lab Liaoning Integrated Circuits Technol, Dalian 116024, Peoples R China..Yu, Jun,Huang, Zhengxing,Tang, Zhenan.Thermal boundary resistance between the polycrystalline graphene and the amorphous SiO2 substrate[J],CHEMICAL PHYSICS LETTERS,2017,685:349-353
- [10] Huang, Zhengxing.Huang, ZX (reprint author), Dalian Univ Technol, Fac Elect Informat & Elect Engn, Dalian 116024, Peoples R China..Tang, Zhenan,Guan, Jingwei,Zhang, Fengtian,Wang, Jiaqi,Bai, Suyuan.Size Effect of Heat Transport in Microscale Gas Gap[J],IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2017,64(9):7387-7391