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孔铭扬, 刘志春, 王海刚, 徐德志, 王瀚彬, 赵祉澎, huangzhengxing, Junsheng Liang.Remarkable enhancement of thermal conductivity induced by coordination transition in SiO2 thin films[J],Journal of Materials Science,2024
He, Tiantian, Li, Ting, Huang, Zhengxing, Tang, Zhenan, Guan, Xiangyu, ZX (reprint author), Dalian Univ Technol, Fac Elect Informat & Elect Engn, Key Lab Liaoning Integrated Circuits Technol, Dalian 116024, Peoples R China..Mechanical and thermal properties of the coaxial carbon nanotube@boron nitride nanotube composite[J],PHYSICA E-LOW-DIMENSIONAL SYSTEMS & NANOSTRUCTURES,2019,107:182-186
贺天天, 李婷, 黄正兴, 唐祯安.Mechanical and thermal properties of the coaxial carbon nanotube@boron[J],Physica E,2019,107:182-186
Qu, Shilian, Tang, Zhenan, Jia, Yuzhen, Lian, YouYun, Liu, Xiang, Wei, Sun, Hao, Kreter, Arkadi, Yuan, Yue, Cheng, Long, Huang, Zhengxing, Xu, Ben, Chen, Wanqi, Cui, W (reprint author), Tsinghua Univ, Sch Mat Sci & Engn, Lab Adv Mat, Beijing 100084, Peoples R China..Degradation of thermal conductivity of the damaged layer of tungsten irradiated by helium-plasma[J],FUSION ENGINEERING AND DESIGN,2018,137:97-103
黄正兴, 孙豪, 李奇松, 管相宇.InSb薄膜热导率温度特性及传热机理[J],大连理工大学学报,2018,58(5):519-525
Li, Ting, Tang, Zhenan, Huang, Zhengxing, Yu, Jun, ZX (reprint author), Dalian Univ Technol, Fac Elect Informat & Elect Engn, Key Lab Liaoning Integrated Circuits Technol, Dalian 116024, Peoples R China..Substrate effects on the thermal performance of in-plane graphene/hexagonal boron nitride heterostructures[J],CARBON,2018,130:396-400

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