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面向IC新封装技术的超薄晶圆磨削机理及技术基础

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Leading Scientist:zhuxianglong

Project Participants:zhaofuling,Dong Zhigang,wangruili,Shang GAO

Supported by:国家自然科学基金项目

Sub-Class of Project:青年科学基金项目

Status:结题

Supported by:国家自然科学基金委员会

Nature of Project:纵向

Project Approval Number:51305058

Date of Project Approval:2013-09-25

Scheduled completion time:2016-12-31

Date of Project Initiation:2014-01-01

Date of Project Completion:2016-12-31

Pre One:激光散射检测半导体硅片亚表面损伤的基础研究