Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] 邱瑞鹏.Maggie Guo,Shang GAO,王雪飞,Gao, Shang; Wang, Xuefei.邓曰明.Prediction model and experimental investigation of mid-spatial-frequency error in bonnet polishing of off-axis aspheric X-ray mirror[J],Optics Express,2025,33(21):44792 - 44810
- [2] 滕春壮.Shang GAO.徐徜徉,王浩祥,黄金星.Study on subsurface damage depth of multi-wire reciprocating rocking sawing photovoltaic monocrystalline silicon[A],Journal of Physics: Conference Series,2025,3080(1)
- [3] 李洪钢.Maggie Guo,Renke Kang,Shang GAO.谭天才,安东琦.Analytical mechanical model of grinding-induced warpage in open cylindrical thin-shell mirrors[J],International Journal of Mechanical Sciences,2025,307
- [4] 白玉林.Maggie Guo,Shang GAO.李洪钢,李金昊.Study on four-point support inversion method for removing gravity-induced deformation of quasi-cylindrical low-stiffness shell[A],Journal of Physics: Conference Series,2025,3068(1)
- [5] 郭星晨.Renke Kang,Shang GAO.黄金星.Catalytic performance and efficient processing mechanism in photocatalysis-assisted chemical mechanical polishing of yttrium aluminum garnet with UV-MnFe2O4/PMS photocatalytic system[J],COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS,2025,726
- [6] 徐徜徉.苏艳,Renke Kang,Shang GAO.宋鑫,李柠.First-principles insights into the synergistic chemical-mechanical removal mechanism of 4H-SiC in chemical mechanical polishing[J],APPLIED SURFACE SCIENCE,2025,710
- [7] 牛照松.Shang GAO.郭嘉倪,黄金星,王浩祥.Saw marks prediction model and experimental verification in multi-wire reciprocating rocking sawing of monocrystalline silicon[A],Journal of Physics: Conference Series,2025,3080(1)
- [8] 牛浩.Maggie Guo,Shang GAO.李洪钢,张云龙.Study on clamping deformation of the low-stiffness cylindrical mirror considering adhesive effect[A],Journal of Physics: Conference Series,2025,3068(1)
- [9] 孙跃文.Shang GAO,Zhang, Bi,Maggie Guo,Renke Kang,Dong Zhigang.赵杨.Quantitative study of oxidation mechanism in photoelectrochemical mechanical polishing of difficult-to-process semiconductor wafers[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2025,210
- [10] 宋鑫.Guo, Jiani,Renke Kang,Shang GAO.胡博宇.Double-Oxidant-Induced Slurry Reaction Mechanism and Performance on Chemical Mechanical Polishing of 4H-SiC (0001) Wafer.[J],Langmuir : the ACS journal of surfaces and colloids,2024