Release Time:2026-03-29  Hits:

Indexed by: Journal Papers

Document Code: 374262

Date of Publication: 2023-01-15

Journal: 微纳电子技术

Volume: 60

Issue: 01

Page Number: 159-164

ISSN: 1671-4776

Key Words: chemical mechanical polishing(CMP); flatness; process optimization; quartz wafer; surface roughness

CN: 13-1314/TN