Dispersal mechanism of different dispersants and its effect on performance of 4H-SiC polishing slurry
Release Time:2026-03-29 Hits:
Indexed by: Journal Papers
Document Code: 473861
Date of Publication: 2025-01-22
Journal: CERAMICS INTERNATIONAL
Volume: 51
Issue: 3
Page Number: 3943-3952
ISSN: 0272-8842
Key Words: ALUMINA SUSPENSIONS; CMP; MATERIAL REMOVAL; OXIDATION; SAPPHIRE; SI-FACE; SILICON-CARBIDE; STABILITY; SUBSTRATE; SURFACE