location: Current position: Home >> Scientific Research >> Paper Publications

Design and evaluation of soft abrasive grinding wheels for silicon wafers

Hits:

Date of Publication:2022-10-06

Journal:PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN

Affiliation of Author(s):机械工程学院

Volume:227

Issue:B4

Page Number:578-586

ISSN No.:0954-4054

Pre One:A novel reverse helical milling process for reducing push-out delamination of CFRP

Next One:Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained using compression of micro-pillars