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Design and evaluation of soft abrasive grinding wheels for silicon wafers

Release Time:2022-10-07  Hits:

Date of Publication: 2022-10-06

Journal: PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN

Institution: 机械工程学院

Volume: 227

Issue: B4

Page Number: 578-586

ISSN: 0954-4054

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