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A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters

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Date of Publication:2022-10-05

Journal:PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Volume:72

Page Number:461-468

ISSN No.:0141-6359

Key Words:"Grit cutting depth; Analytic model; Grit deflection; Surface roughness; Brittle and hard materials"

Pre One:ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS MEASUREMENT USING THREE-POINT-SUPPORT METHOD

Next One:A novel reverse helical milling process for reducing push-out delamination of CFRP
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