A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters
Release Time:2022-10-07 Hits:
Date of Publication: 2022-10-05
Journal: PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume: 72
Page Number: 461-468
ISSN: 0141-6359
Key Words: "Grit cutting depth; Analytic model; Grit deflection; Surface roughness; Brittle and hard materials"