Current position: Home >> Scientific Research >> Paper Publications

Recent advances in micro- and nano-machining technologies

Release Time:2022-10-08  Hits:

Date of Publication: 2022-10-08

Journal: 机械工程前沿

Institution: 机械工程学院

Volume: 12

Issue: 1,SI

Page Number: 18-32

ISSN: 2095-0233

Prev One:Surface layer damage of silicon wafers sliced by wire saw process

Next One:Development of a measuring equipment for silicon wafer warp
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep