Current position: Home >> Scientific Research >> Paper Publications

Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding

Release Time:2022-10-09  Hits:

Date of Publication: 2022-10-09

Journal: 18th International Symposium on Advances in Abrasive Technology, ISAAT 2015

Institution: 机械工程学院

Prev One:Study on grinding performance of soft abrasive wheel for silicon wafer

Next One:Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates