Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer
Release Time:2022-10-09 Hits:
Date of Publication: 2022-10-09
Journal: ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV
Institution: 机械工程学院
Volume: 416
Page Number: 529-534
ISSN: 1013-9826
Key Words: "Silicon wafer; Grinding; Soft abrasive wheel; Subsurface damage"