Current position: Home >> Scientific Research >> Paper Publications

Warping model of high-power IGBT modules subjected to reflow soldering process

Release Time:2024-07-05  Hits:

Date of Publication: 2024-07-03

Journal: International Journal of Mechanical Sciences

Volume: 251

ISSN: 0020-7403

Prev One:Molecular dynamics simulation analysis of energy deposition on the evolution of single crystal silicon defect system

Next One:Study on Adhesion Properties and Process Parameters of Electroless Deposited Ni-P Alloy for PEEK and Its Modified Materials
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep