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Warping model of high-power IGBT modules subjected to reflow soldering process

Release Time:2024-07-05  Hits:

Indexed by: Journal Papers

Document Code: 363641

Date of Publication: 2023-08-01

Journal: INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Volume: 251

ISSN: 0020-7403

Key Words: BEHAVIOR; DESIGN; FAILURE; GROWTH; JOINTS; LATTICE BOLTZMANN MODEL; RELIABILITY; STRESS; WARPAGE

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