Ultraprecision machining for single-crystal silicon carbide wafers: State-of-the-art and prospectives
Release Time:2026-03-29 Hits:
Indexed by: Journal Papers
Document Code: 480762
Date of Publication: 2025-01-01
Journal: Journal of Advanced Manufacturing Science and Technology
Volume: 5
Issue: 2
ISSN: 2709-2135
Key Words: Grinding; Lapping; Polishing; Semiconductor material; Single crystal SiC; Ultraprecision machining
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