Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] 高尚.Kang, Renke(kangrk@dlut.edu.cn).张璧,康仁科,董志刚,王紫光.工件旋转法磨削硅片的磨粒切削深度模型[J],机械工程学报,2016,52(17):86-93
- [2] 于月滨.Zhou, P.; Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina; email: pzhou@dlut.edu.cn.周平,高尚,郭东明,王紫光.磨削速度和压力对单晶硅去除特性的影响[J],金刚石与磨料磨具工程,2016,36(3):1-5,10
- [3] 林智富.Gao, S.; Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of TechnologyChina; email: gaoshangf@gmail.com.王紫光,耿宗超,高尚,康仁科.固结金刚石研磨盘加工蓝宝石基片的磨削性能研究[J],人工晶体学报,2016,45(5):1317-1322
- [4] Dong, Zhigang.Kang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, Dalian 116024, Peoples R China..Gao, Shang,Huang, Han,Kang, Renke,Wang, Ziguang.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2016,83(5-8):1231-1239
- [5] Liu, Haijun.Dong, ZG (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining, Minist Educ, 2 Linggong Rd, Dalian 116024, Peoples R China..Zhou, Ping,Gao, Shang,Dong, Zhigang,Kang, Renke.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS MEASUREMENT USING THREE-POINT-SUPPORT METHOD[J],METROLOGY AND MEASUREMENT SYSTEMS,2015,22(4):531-546
- [6] 高尚.康仁科,朱祥龙,郭东明.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],2015
- [7] 高尚.康仁科,张璧,郭东明,董志刚.Warping of silicon wafers subjected to back-thinning process[J],Precision Engineering,2015,40(-):87-93
- [8] 董志刚.郭东明,高尚,康仁科.Investigation on properties of magnesia grinding wheels used in silicon wafer grinding[A],2014,117(-):273-278
- [9] 高尚.康仁科,郭晓光.Grinding performance of diamond grinding tools for sapphire crystal[A],2014,117(-):544-548
- [10] Gao, Shang.Kang, RK (reprint author), Dalian Univ Technol, Key Lab Precis & Nontradit Machining Technol, Minist Educ, 2 Linggong Rd, Dalian 116023, Peoples R China..Kang, Renke,Guo, Dongming,Dong, Zhigang.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2013,227(B4):578-586