Current position: Home >> Scientific Research >> Patents

一种用于半导体晶片自旋转磨削的无线检测平台及检测方法

Release Time:2026-03-13  Hits:

First Author: Shang GAO

Disigner of the Invention: Renke Kang,杨鑫,Dong Zhigang,黄金星,zhuxianglong

Institution: 机械工程学院

Application Date: 2021-05-24

Application Number: 202110565515.6

Authorization Date: 2022-02-16

Authorization Number: ZL 202110565515.6

Prev One:一种双激励超声椭圆振动切削装置

Next One:一种具备过压泄荷功能的磨抛一体晶片减薄机