Release Time:2026-03-13 Hits:
First Author: zhuxianglong
Disigner of the Invention: Renke Kang,Dong Zhigang,马进,Shang GAO,Harry,HANG GAO
Institution: 机械工程学院
Authorization Date: 2023-07-05
Prev One:一种预测IGBT模块在回流焊工艺中变形量的方法
Next One:一种消除重力影响的薄基片变形测量方法