一种光化学与机械抛光相结合的半导体晶片加工方法
Release Time:2026-03-13 Hits:
First Author: Dong Zhigang
Disigner of the Invention: Renke Kang,欧李苇,时康,Shang GAO,zhuxianglong
Institution: 机械工程学院
Application Date: 2018-12-14
Application Number: 201811535751.8
Release Time:2026-03-13 Hits:
First Author: Dong Zhigang
Disigner of the Invention: Renke Kang,欧李苇,时康,Shang GAO,zhuxianglong
Institution: 机械工程学院
Application Date: 2018-12-14
Application Number: 201811535751.8