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个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
毕业院校：东京大学
学位：博士
所在单位：材料科学与工程学院
电子邮箱：yunpengw@dlut.edu.cn
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- [21]马海涛, 赵宁, 王云鹏.Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-e...[A],2018,396-399
- [22]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
- [23]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng.Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Ag...[A],2018,1744-1747
- [24]Zhao, Ning, Chen, Shi, Liu, Chunying, Zhong, Yi, Ma, Haitao, Wang, Yunpeng.Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient[A],2018,603-606
- [25]Guo, Bingfeng, Huang, Ru, Yao, Jinye, Qi, Xiao, Kunwar, Anil, Wang, Yunpeng, Ma, Haitao.Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni so...[A],2018,445-449
- [26]Ma, Haoran, Yao, Jinye, Wang, Chen, Shang, Shengyan, Yunpeng, Haitao.Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple ref...[A],2018,441-444
- [27]Qi, Xiao, Ma, Haoran, Huang, Ru, Yao, Jinye, Shang, Shengyan, Anil, Wang, Yunpeng, Haitao.Study on Electrochemical Migration of Sn-0.7Cu[A],2018,387-390
- [28]Shang, Shengyan, Kunwar, Anil, Wang, Yanfeng, Yao, Jinye, Ma, Haitao, Yunpeng.Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints[A],2018,135-140
- [29]Zhong, Y., Zhao, N., Dong, W., Qiao, Y. Y., Wang, Y. P., Ma, H. T., Liu, C. Y., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
- [30]Ma, Haoran, Kunwar, Anil, Huang, Ru, Chen, Jun, Wang, Yunpeng, Zhao, Ning, Haitao, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
- [31]Ma, Haoran, Zhao, Ning, Haitao, Kunwar, Anil, Chen, Jun, Wang, Yunpeng, HT, Zhao, N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
- [32]Zhao, Ning, Deng, Jianfeng, Zhong, Yi, Ma, Haitao, Wang, Yunpeng, Wong, Ching-ping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2017,32(18):3555-3563
- [33]Guo, Bingfeng, Ma, Haitao, Jiang, Chengrong, Wang, Yunpeng, Kunwar, Anil, Zhao, Ning, Huang, Mingliang, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder jo...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28(7):5398-5406
- [34]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Wang, Yunpeng, Wong, Ching-Ping.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
- [35]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Chen, Jun, Zhao, Ning, Wang, Yunpeng, Ma, Haitao.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017,974-979
- [36]Guo, Bingfeng, Jiang, Chengrong, Kunwar, Anil, Zhao, Ning, Chen, Jun, Wang, Yunpeng, Ma, Haitao.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017,1087-1091
- [37]Ma, H. R., Wang, Y. P., Chen, J., H. T., Zhao, N..The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during mult...[A],2017,1402-1405
- [38]Zhao, Ning, Wang, Mingyao, Zhong, Yi, Ma, Haitao, Yunpeng, Wong, Ching-Ping.Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient[A],2017,1478-1482
- [39]Kunwar, Anil, Tonks, Michael R., Shang, Shengyan, Song, Xueguan, Wang, Yunpeng, Ma, Haitao.Quantitative Polynomial Free Energy based Phase Field Model for Void Motion and Evolution in Sn...[A],2017,1502-1507
- [40]Ma, Haoran, Kunwar, Anil, Guo, Bingfeng, Sun, Junhao, Jiang, Chengrong, Wang, Yunpeng, Song, Xueguan, Zhao, Ning, Haitao, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder ...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2016,122(12)