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论文类型：会议论文

发表时间：2011-08-08

收录刊物：EI、CPCI-S、Scopus

页面范围：342-345

摘要：The as-soldered microstructures of intermetallic compounds (IMC) in Sn-Ag/Cu joint were investigated under different soldering temperatures and cooling rates. Scalloped, faceted, prismatic and hexagonal shape Cu6Sn5 grains were observed at the solder/Cu interface, respectively. Scalloped shape grains were found at 250 degrees C. At higher soldering temperatures such as 275 degrees C and 300 degrees C, faceted grains were dominant and the other two were mainly discovered under smaller cooling rates. Simultaneously, large plate-like Ag3Sn formed in virtue of interfacial Cu6Sn5 under furnace cooling, which was discussed based on the solidification sequence.