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发布时间：2019-03-09

论文类型：期刊论文

发表时间：2011-06-01

发表刊物：JOURNAL OF MATERIALS RESEARCH

收录刊物：EI、SCIE、Scopus

卷号：26

期号：12

页面范围：1468-1471

ISSN号：0884-2914

摘要：The formation of interfacial eta'-Cu6Sn5 in Sn-0.7Cu/Cu solder joints at different aging temperatures was studied using x-ray diffraction (XRD). The time-temperature-formation curve was obtained and is discussed based on the phase transformation from existing eta-Cu6Sn5 and interfacial reaction at temperatures below 186 degrees C. A minimum formation time was observed in the temperature range of 135-150 degrees C.