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论文类型：会议论文

发表时间：2011-04-15

收录刊物：EI、CPCI-S、SCIE、Scopus

卷号：16

页面范围：807-811

关键字：Sn-0.7Cu; zinc; shear; reflowing; microstructure; deposition

摘要：Effect of zinc addition on the shear property evolution between Sn-0.7Cu solder alloy and their joints reflowed at 250 degrees C was investigated. The shear strength of Sn-0.7Cu/Cu joint was found to be higher than of Sn-0.7Cu solder alloy. Although a small addition of zinc element strengthened Sn-0.7Cu solder alloy, it decreased the shear strength of Sn-0.7Cu solder joints. Based on the fractography analysis and interfacial microstructure observation, it is proposed that the deposition of Cu-Zn intermetallic toward the interface during reflowing is largely responsible for the shear property evolution between the Sn-0.7Cu solder alloy and their joints. (c) 2010 Published by Elsevier Ltd. Selection and/or peer-review under responsibility of Society for Automobile, Power and Energy Engineering