Current position: Home >> Scientific Research >> Research Projects

从基体金属溶解的角度研究现代电子封装中固/液界面反应

Release Time:2016-08-09  Hits:

Leading Scientist: Mingliang Huang

Institution: 材料科学与工程学院

Project Source: 国家自然科学基金项目

Project Level: National level

Sub-Class of Project: 专项基金项目

Status: 结题

Supported by: National Natural Science Foundation of China

Nature of Project: 纵向

Project Approval Number: 50641007

Date of Project Approval: 2006-09-25

Scheduled Completion Time: 2007-12-31

Date of Project Initiation: 2007-01-01

Date of Project Completion: 2007-12-31

Prev One:2006年度教育部新世纪优秀人才支持计划

Next One:含有毒有害元素材料的替代技术