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Mingliang Huang
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Patents
[1] 一种无氰Au-Sn合金镀液及其制备方法和应用
[2] 一种金属间化合物薄膜的制备方法
[3] 金属间化合物薄膜的制备方法
[4] 金属间化合物填充三维封装垂直通孔及其制备方法
[5] 一种三维封装芯片堆叠用金属间化合物键合方法及键合结构
[6] 倒装芯片用全金属间化合物互连焊点的制备方法及结构
[7] 一种金属间化合物填充的三维封装垂直通孔及其制备方法
[8] 一种全金属间化合物互连焊点的制备方法及结构
[9] Sn-Zn-Bi基无铅钎料合金在铝铜软钎焊中的应用
[10] 一种用于铝铜软钎焊的Sn-Zn-Ni无铅钎料合金
TOTAL 19 PIECE 1/2
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