Current position: Home >> Scientific Research >> Patents

倒装芯片用全金属间化合物互连焊点的制备方法及结构

Hits:

First Author:Zhao Ning

Disigner of the Invention:Mingliang Huang,钟毅,mahaitao,刘亚伟,huangfeifei

Application Number:CN201510068044.2

Authorization Date:2015-02-09

Authorization number:CN104716058A

Pre One:一种三维封装芯片堆叠用金属间化合物键合方法及键合结构

Next One:一种金属间化合物填充的三维封装垂直通孔及其制备方法
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep