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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Scientific Research
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- Mingliang Huang.周德祥,暴杰,赵凡志.尹斯奇.航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化[J],微电子学与计算机,2024(11):136-142
- Chen, Zhikai.Liu, Peng,任婧,Mingliang Huang.Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- Yuan, Mingqi.Mingliang Huang.朱琳.Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- Li, Li.Mingliang Huang.王胜博,陈俊琳.Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- Yin, S.Q..任婧,Mingliang Huang.Electromigration behavior of Sn-3.0Ag-0.5Cu/Sn-37Pb hybrid solder joints with various mixed percentages for aerospace electronics[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(12)
- Kuang, J. M..Mingliang Huang.Mechanism on scalloped Cu6Sn5 grain refinement under interaction of Cu and Ni[J],Materials Letters,341
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