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Mingliang Huang

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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

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Mingliang Huang, 尹斯奇, 周德祥, 暴杰, 赵凡志.航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化[J],微电子学与计算机,2024,11:136-142
Chen, Zhikai, Liu, Peng, renjing, Mingliang Huang.Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
Yuan, Mingqi, 朱琳, Mingliang Huang.Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
Li, Li, 王胜博, 陈俊琳, Mingliang Huang.Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
Yin, S.Q., renjing, Mingliang Huang.Electromigration behavior of Sn-3.0Ag-0.5Cu/Sn-37Pb hybrid solder joints with various mixed percentages for aerospace electronics[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(12)
Kuang, J. M., Mingliang Huang.Mechanism on scalloped Cu6Sn5 grain refinement under interaction of Cu and Ni[J],Materials Letters,341

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