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Scientific Research
Mingliang Huang
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Scientific Research
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Mingliang Huang, 尹斯奇, 周德祥, 暴杰, 赵凡志.航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化[J],微电子学与计算机,2024,11:136-142
Chen, Zhikai, Liu, Peng, renjing, Mingliang Huang.Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
Yuan, Mingqi, 朱琳, Mingliang Huang.Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
Li, Li, 王胜博, 陈俊琳, Mingliang Huang.Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
Yin, S.Q., renjing, Mingliang Huang.Electromigration behavior of Sn-3.0Ag-0.5Cu/Sn-37Pb hybrid solder joints with various mixed percentages for aerospace electronics[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(12)
Kuang, J. M., Mingliang Huang.Mechanism on scalloped Cu6Sn5 grain refinement under interaction of Cu and Ni[J],Materials Letters,341
Patents
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一种无氰Au-Sn合金镀液及其制备方法和应用
一种金属间化合物薄膜的制备方法
金属间化合物薄膜的制备方法
金属间化合物填充三维封装垂直通孔及其制备方法
一种三维封装芯片堆叠用金属间化合物键合方法及键合结构
倒装芯片用全金属间化合物互连焊点的制备方法及结构
Published Books
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Research Projects
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低温高可靠性无铅合金开发技术合作项目, 企事业单位委托科技项目, 2024/04/03, 在研
英特尔赞助研究协议——液体热界面材料控制, 企事业单位委托科技项目, 2024/03/26, 在研
晶圆级Sn-Ag微凸点电沉积机理与芯片互连可靠性, 国家自然科学基金项目, 2023/12/29, 在研
功率型IGBT器件高效散热封装互连技术, 省、市、自治区科技项目, 2022/07/01, 在研
互连焊点电迁移特性研究项目, 企事业单位委托科技项目, 2022/06/01-2023/12/31, 结题
SMT器件低温混装可靠性技术1.0项目, 企事业单位委托科技项目, 2021/10/18-2022/12/31, 结题