9TU0peFaPKjzvrzKCvAPepc38JHONmfIgv7o6yuRWWNx6uHUE9qUIjo8QuZX
Current position: Home >> Scientific Research >> Research Projects

晶圆级Sn-Ag微凸点电沉积机理与芯片互连可靠性

Release Time:2024-04-01  Hits:

Leading Scientist: 黄明亮

Project Participants: 任婧,黄斐斐

Project Source: 国家自然科学基金项目

Sub-Class of Project: Original Exploration Program Project

Status: 在研

Supported by: National Natural Science Foundation of China

Nature of Project: 纵向

Project Approval Number: 52350321

Date of Project Approval: 2023-12-29

Scheduled Completion Time: 2026-12-31

Date of Project Initiation: 2024-01-01

Prev One:英特尔赞助研究协议——液体热界面材料控制

Next One:功率型IGBT器件高效散热封装互连技术