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晶圆级Sn-Ag微凸点电沉积机理与芯片互连可靠性

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Leading Scientist:黄明亮

Project Participants:renjing,huangfeifei

Supported by:国家自然科学基金项目

Sub-Class of Project:原创探索计划项目

Status:在研

Supported by:国家自然科学基金委员会

Nature of Project:纵向

Project Approval Number:52350321

Date of Project Approval:2023-12-29

Scheduled completion time:2026-12-31

Date of Project Initiation:2024-01-01

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