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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Paper Publications

[1]Mingliang Huang, 尹斯奇, 周德祥, 暴杰, 赵凡志.航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化[J],微电子学与计算机,2024,11:136-142
[2]Chen, Zhikai, Liu, Peng, renjing, Mingliang Huang.Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
[3]Yuan, Mingqi, 朱琳, Mingliang Huang.Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
[4]Li, Li, 王胜博, 陈俊琳, Mingliang Huang.Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
[5]Yin, S.Q., renjing, Mingliang Huang.Electromigration behavior of Sn-3.0Ag-0.5Cu/Sn-37Pb hybrid solder joints with various mixed perce...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(12)
[6]Kuang, J. M., Mingliang Huang.Mechanism on scalloped Cu6Sn5 grain refinement under interaction of Cu and Ni[J],Materials Letters,341
[7]Zhao, W.T., Ren, J., Mingliang Huang.Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0...[J],2024
[8]renjing, huangfeifei, Mingliang Huang.Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders[J],JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,31:165-169
[9]Liu, Shanhong, renjing, Mingliang Huang.Microstructural evolution and thermal fatigue reliability of Sn-Ag-Cu/Sn-Bi-Ag hybrid BGA solder ...[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
[10]Zhang, Shuye, Huang, Mingliang, Wu, Yang, Yang, Ming, Lin, Tiesong, He, Peng, Paik, Kyung-Wook.A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of ...[A],2019,2019-May:2022-2028

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