Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
- [1] Mingliang Huang.周德祥,暴杰,赵凡志.尹斯奇.航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化[J],微电子学与计算机,2024(11):136-142
- [2] Chen, Zhikai.Liu, Peng,任婧,Mingliang Huang.Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- [3] Yuan, Mingqi.Mingliang Huang.朱琳.Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- [4] Li, Li.Mingliang Huang.王胜博,陈俊琳.Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- [5] Yin, S.Q..任婧,Mingliang Huang.Electromigration behavior of Sn-3.0Ag-0.5Cu/Sn-37Pb hybrid solder joints with various mixed percentages for aerospace electronics[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(12)
- [6] Kuang, J. M..Mingliang Huang.Mechanism on scalloped Cu6Sn5 grain refinement under interaction of Cu and Ni[J],Materials Letters,341
- [7] Zhao, W.T..Ren, J.,Mingliang Huang.Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints[J],2024
- [8] 任婧.黄斐斐,Mingliang Huang.Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders[J],JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,2024,31:165-169
- [9] Liu, Shanhong.任婧,Mingliang Huang.Microstructural evolution and thermal fatigue reliability of Sn-Ag-Cu/Sn-Bi-Ag hybrid BGA solder joints assembled by low-temperature soldering[A],2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,2024
- [10] Zhang, Shuye.Yang, Ming,Lin, Tiesong,He, Peng,Paik, Kyung-Wook,Huang, Mingliang,Wu, Yang.A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films[A],2019,2019-May:2022-2028