Microstructural evolution and thermal fatigue reliability of Sn-Ag-Cu/Sn-Bi-Ag hybrid BGA solder joints assembled by low -temperature soldering
Release Time:2024-09-10 Hits:
Indexed by: Conference Paper
Document Code: 391940
Date of Publication: 2023-01-01
Journal: 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT
ISSN: 2836-9734