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Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders

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Date of Publication:2024-09-05

Journal:JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

Volume:31

Page Number:165-169

ISSN No.:2238-7854

Key Words:ADDITIONS; ALLOYS; BI-AG-CU; CREEP-BEHAVIOR; MECHANICAL-PROPERTIES; MIGRATION; SEGREGATION; SN-58BI SOLDER; ZN

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