Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders
Release Time:2024-09-10 Hits:
Indexed by: Journal Papers
Document Code: 395189
Date of Publication: 2024-06-10
Journal: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume: 31
Page Number: 165-169
ISSN: 2238-7854
Key Words: ADDITIONS; ALLOYS; BI-AG-CU; CREEP-BEHAVIOR; MECHANICAL-PROPERTIES; MIGRATION; SEGREGATION; SN-58BI SOLDER; ZN