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Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders

Release Time:2024-09-10  Hits:

Date of Publication: 2024-09-05

Journal: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

Volume: 31

Page Number: 165-169

ISSN: 2238-7854

Key Words: ADDITIONS; ALLOYS; BI-AG-CU; CREEP-BEHAVIOR; MECHANICAL-PROPERTIES; MIGRATION; SEGREGATION; SN-58BI SOLDER; ZN

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