Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints
Release Time:2024-09-10 Hits:
Indexed by: Journal Papers
Document Code: 396055
Date of Publication: 2024-10-10
Journal: JOURNAL OF ELECTRONIC MATERIALS
Volume: 53
Issue: si
Page Number: 6463-6470
ISSN: 0361-5235
Key Words: STRENGTH