Electromigration-induced failure behavior of low -temperature Cu/Sn-57Bi-1 Ag/Cu solder j oints
Release Time:2024-09-10 Hits:
Indexed by: Conference Paper
Document Code: 391924
Date of Publication: 2023-01-01
Journal: 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT
ISSN: 2836-9734