Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows
Release Time:2024-09-10 Hits:
Indexed by: Conference Paper
Document Code: 391903
Date of Publication: 2023-01-01
Journal: 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT
ISSN: 2836-9734
Key Words: JOINTS