location： Current position: Home >> Scientific Research >> Paper Publications

Full Ni3Sn4 IMC interconnects prepared by current driven bonding (CDB) method

Hits:

Date of Publication:2024-05-18

Journal:2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023

Pre One:航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化

Next One:Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep