航天电子微焊点液-固界面反应过程中的尺寸效应与工艺优化
Release Time:2024-09-10 Hits:
Indexed by: Journal Papers
Document Code: 388758
Date of Publication: 2023-12-06
Journal: 微电子学与计算机
Volume: 40
Issue: 11
Page Number: 136-142
ISSN: 1000-7180
Key Words: interfacial reaction; micro-solder joints; process optimization; size effect
CN: 61-1123/TN