Electromigration behavior of Sn-3.0Ag-0.5Cu/Sn-37Pb hybrid solder joints with various mixed percentages for aerospace electronics
Release Time:2024-09-10 Hits:
Indexed by: Journal Papers
Document Code: 391560
Date of Publication: 2024-04-10
Journal: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume: 35
Issue: 12
ISSN: 0957-4522
Key Words: MICROSTRUCTURE