Current position: Home >> Scientific Research >> Research Projects

SMT器件低温混装可靠性技术1.0项目

Hits:

Leading Scientist:黄明亮

Project Participants:朱琳,任婧,huangfeifei

Supported by:企事业单位委托科技项目

Status:结题

Supported by:荣耀终端有限公司

Nature of Project:横向

Date of Project Approval:2021-10-18

Scheduled completion time:2022-12-31

Date of Project Initiation:2021-10-18

Date of Project Completion:2022-12-29

Pre One:互连焊点电迁移特性研究项目

Next One:应用于先进封装中高速电镀锡银溶液的研发项目