KXg8o57IjE3qGck7kqDzwIHmoxmxAvk3DbXKW2NwTlkPB3JNmJDUTRDF7Rky
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应用于先进封装中高速电镀锡银溶液的研发项目

Release Time:2023-11-07  Hits:

Leading Scientist: 黄明亮

Project Participants: 王云鹏,黄斐斐

Project Source: 企事业单位委托科技项目

Status: 结题

Supported by: Huawei Technologies Co., Ltd.

Nature of Project: 横向

Date of Project Approval: 2021-07-01

Scheduled Completion Time: 2022-12-31

Date of Project Initiation: 2021-07-01

Date of Project Completion: 2023-06-06

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