Release Time:2019-03-10  Hits:

Indexed by: Conference Paper

Date of Publication: 2016-08-16

Included Journals: Scopus、CPCI-S、EI

Page Number: 301-303

Key Words: bath temperaturet; co-electroplating; Au-Sn alloys; electrochemical behavior

Abstract: Au-30at.%Sn eutectic alloy is useful in electronics for its superior mechanical and thermal conduction properties. Compared with traditional methods (Au-Sn solder preform and evaporation), the electroplating is an attractive method to obtain Au-Sn solder due to its cost-effective. In this work, Au-Sn films were co-electroplated via a pyrophosphate based bath. Electrochemical studies have been conducted to examine the effects of bath temperature on plating process. It was found that the rate for deposition of Au-Sn alloys was increased with bath temperature increased. Besides, the effects of bath temperature on the morphology and composition of electrodeposits were discussed.