mgcJ01RCfgg7eppnCt28DTaGIgglG4vaWk2bP8BPiltFUnLfsIlt17rrRS6g
Current position: Home >> Scientific Research >> Paper Publications

Effect of [Au]/[Na2SO3] Molar Ratio on Co-electroplating Au-Sn Alloys in Sulfite-based Solution

Release Time:2019-03-12  Hits:

Indexed by: Conference Paper

Date of Publication: 2009-01-01

Page Number: 878-881

Prev One:The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

Next One:Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect