Release Time:2019-03-12 Hits:
Indexed by: Conference Paper
Date of Publication: 2009-01-01
Page Number: 878-881
Prev One:The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields
Next One:Effect of Electromigration on Intermetallic Compound Formation in Cu/Sn/Cu Interconnect