Current position: Home >> Scientific Research >> Paper Publications

机械大类工程教育专业认证探析

Release Time:2019-03-12  Hits:

Indexed by: Journal Article

Date of Publication: 2012-01-01

Journal: 大连理工大学学报(社科版)

Volume: 12

Issue: S1

Page Number: 92-94

Prev One:Effects of cooling rate and solder volume on the formation of large Ag 3Sn plates in Sn-Ag based solder joints

Next One:Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints