location: Current position: Home >> Scientific Research >> Paper Publications

机械大类工程教育专业认证探析

Hits:

Indexed by:期刊论文

Date of Publication:2012-01-01

Journal:大连理工大学学报(社科版)

Volume:12

Issue:S1

Page Number:92-94

Pre One:Effects of cooling rate and solder volume on the formation of large Ag 3Sn plates in Sn-Ag based solder joints

Next One:Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints