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Dominant effect of high anisotropy in beta-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu

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Indexed by:期刊论文

Date of Publication:2016-01-01

Journal:Journal of Alloys and Compounds

Volume:678

Issue:1

Page Number:370-374

Pre One:Study on the electromigration-induced failure mechanism of Sn-3.0 Ag-0.5Cu BGA solder balls

Next One:On the increase of intermetallic compounds thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
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