Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage
Release Time:2019-03-12 Hits:
Indexed by: Journal Article
Date of Publication: 2016-01-01
Journal: Journal of Material Science: Materials in Electronics
Volume: 28
Issue: 1
Page Number: 5398-5406