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Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling stage

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Indexed by:期刊论文

Date of Publication:2016-01-01

Journal:Journal of Material Science: Materials in Electronics

Volume:28

Issue:1

Page Number:5398-5406

Pre One:Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates

Next One:Dominant effect of diffusion anisotropy in β-Sn grain on electromigration behavior of SnAgCu solder bumps
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