location： Current position: Home >> Scientific Research >> Paper Publications

Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect

Hits:

Indexed by:Journal Papers

Date of Publication:2017-01-01

Journal:Acta Metallurgica Sinica

Included Journals:PKU

Volume:53

Issue:9

Page Number:592-600

Pre One:Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient

Next One:Study on Co-Electrodeposition Mechanism of Au-30at.%Sn Eutectic in Non-Cyanide Bath by Electrochemical Methods
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep