Current position: Home >> Scientific Research >> Paper Publications

Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect

Release Time:2019-03-12  Hits:

Indexed by: Journal Papers

Date of Publication: 2017-01-01

Journal: Acta Metallurgica Sinica

Included Journals: PKU

Volume: 53

Issue: 9

Page Number: 592-600

Prev One:Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient

Next One:Study on Co-Electrodeposition Mechanism of Au-30at.%Sn Eutectic in Non-Cyanide Bath by Electrochemical Methods
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep