Current position: Home >> Scientific Research >> Paper Publications

刘晓英；马海涛；罗忠兵； 赵艳辉； 黄明亮； 王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响

Release Time:2019-03-13  Hits:

Indexed by: Journal Article

Date of Publication: 2012-01-01

Journal: 中国有色金属学报,

Included Journals: ISTIC、PKU

Volume: 22

Issue: 4

Page Number: 1169-1172

Prev One:In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology

Next One:Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:Times MOBILE Version
The Founding Time : ..
The Last Update Time : ..

Mobile phone sweep