Hits:
Indexed by:Journal Papers
Date of Publication:2018-01-01
Journal:IEEE Transaction on Components
Included Journals:EI
Volume:6
Issue:1
Page Number:1-8
Pre One:Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage
Next One:Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging
