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Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172(2016) 211-215]

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Indexed by:Journal Papers

Date of Publication:2018-01-01

Journal:Materials Letter

Included Journals:SCIE、EI

Volume:230

Page Number:76-76

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