Release Time:2016-10-18  Hits:

Major: Materials Science

Education Level: With Certificate of Graduation for Study as Master's Candidates

Degree: Master's Degree

Current Status: Graduated

Graduation Thesis Title: 倒装芯片Ni/Sn-3.0Ag-0.5Cu/ENEPIG（OSP）无铅焊点的电迁移行为

Date of Registration: 2008-09-01

Date of Graduation: 2011-07-05