Release Time:2016-10-18  Hits:

Major:Materials Science

Education Level:With Certificate of Graduation for Study as Master's Candidates

Degree:Master's Degree

Current Status:Graduated

Graduation Thesis Title: 倒装芯片Ni/Sn-3.0Ag-0.5Cu/ENEPIG（OSP）无铅焊点的电迁移行为

Date of Registration:2008-09-01

Date of Graduation:2011-07-05